MEI’s industry leading Engineering department is structured to support and solve our customer’s critical requirements.
Supporting a wide range of PCB technologies from high frequency materials, stacked vias, RF & high speed digital applications, MEI’s Engineering department executes a myriad of critical programs by working closely with our customers in the earliest stages of their design.
Directly engaged with our material partners; Rogers Corp, Panasonic, Nanya, Isola and Park Nelco, MEI delivers the latest in technical and process capabilities to our customers. With a history of solving the challenges of ever increasing density, MEI provides solutions utilizing stacked, offset and staggered microvias on a variety of materials for military and commercial applications. All tooling takes place at MEI, utilizing Valor Genesis in concert with our experienced and talented Engineering staff.